Wintouch
Technology pillars

The technology behind every panel.

Five technology pillars define how Wintouch engineers commercial displays — platform, panel, mechanical, voice & AI, manufacturing.

01Platform engineering
02Panel sourcing
03Mechanical
04Voice & AI
05Manufacturing
  1. 01Platform engineering

    Rockchip, MediaTek, Allwinner & Intel

    We engineer reference designs across four SoC families. The catalogue defaults to Rockchip RK3566 (Android 11/Debian 11) for general signage, MediaTek MT9679 (Android 14) for interactive whiteboards, Allwinner A523 for low-power control panels, and Intel i5 for large-format Windows installations.

    Default platform
    RK3566
    IFP platform
    MT9679
    Smart Home
    A523 / RK3588
    Win flagship
    Intel i5
  2. 02Panel sourcing

    LG / BOE / Innolux — A-grade only

    All panels are LG, BOE or Innolux A-grade. We never substitute B-grade or refurbished panels — the buyer's spec sheet is the contract. Anti-glare bonding, optical clear adhesive (OCA) full lamination on transparent and IFP lines.

    Panel grade
    A-only
    Brightness range
    300–2500 nits
    Color
    1.07B · 99% sRGB
    Bonding
    OCA / anti-glare
  3. 03Mechanical

    Aluminium profile, SGCC steel, IP65

    Indoor lines: anodised aluminium profile + 3 mm tempered glass. Outdoor lines: 1.5 mm SGCC galvanised steel + 5 mm explosion-proof tempered glass with Aksu outdoor powder coat (10-year service life). Lightning, surge and over-temperature protection are standard on the OD line.

    Indoor housing
    Aluminium
    Outdoor housing
    SGCC steel
    Glass
    3–5 mm tempered
    Coat life
    10 years
  4. 04Voice & AI

    Far-field array MIC + on-device NPU

    The hologram capsule and space capsule lines ship with linear 4-array MIC (space capsule, 36° pickup), 8-array MIC (hologram, 180° beam-forming), 6–10 m far-field range, automatic gain, echo cancellation, voice enhancement and noise suppression. Rockchip RK3588 6T NPU handles avatar lip-sync on device.

    MIC type
    4/8-array
    Pickup range
    6–10 m
    NPU
    6 TOPS
    Camera
    8–12 MP
  5. 05Manufacturing

    In-house glass, board and assembly

    CNC glass cutting + OCA bonding in cleanroom conditions. SMT lines with X-ray AOI. ESD-controlled assembly with dual sign-off QC at every gate. 48-hour burn-in soak on every unit before shipping.

    SMT lines
    5
    QC gates
    4
    Burn-in
    48 hours
    Capacity
    30K+ / mo
06 · Get the engineering pack

Need the full technical pack?

CAD files, full spec sheets, panel datasheets and firmware release notes — available on request to engineering teams.